卷带COF模块冲切外协厂商钨钢模冲切
苏州恒迈瑞材料科技为专业的卷带COF冲切供应商，可以将卷料COF封装芯片冲切为单片，由于激光冲切产生碳粉导致COF模块显示异常或短路，用钨钢模冲切模具冲切为单片可解决该问题，欢迎致电恒迈瑞了解更多COF冲切相关信息及咨询。
冲切后的单片COF包装方式为定制防静电包装托盘。该托盘根据COF尺寸规格定制，不会导致污染及弯折。
卷带COF冲切基本参数：
Reel COF Film Diameter: 800mm
Singulation Precision: X axis = ±0.1 mm, Y axis=±0.1 mm
Reel COF Punch Max Dimension: 60mm*60mm
Reel COF Punch Min Dimension: 20mm*10mm
Punch Unit Cycle time: 3 seconds
Singulation Yield (Mass Production): ≥ 99%
Reel COF Laser cutting relies on instant high temperature, but there're carbon powder or ash remains on the film cutting edge.The carbon powders or ash remains( contamination) will cause the short when it perform OLB process bonding with PCB and Panel side.
卷带COF模块冲切外协厂商钨钢模冲切
the Reel COF Singulation Machine make use of accurate cylinder stamping by precise reel COF steel punch tool. It's the most reliable and most stable Reel COF shape cutting and Reel COF Shape Punch way for mass production.
卷带COF封装芯片冲切为单颗
