■ 特长 Features
●体积小、重量轻
·Miniature and light weight.
● 适应再流焊与波峰焊
·Suit for reflow and wave flow solder.
●电性能稳定，可靠性高
·Stable electrical capability, high reliability.
●装配成本低，并与自动装贴设备匹配
Low assembly cost, suit for automatic SMT equipment
.
●机械强度高、高频特性优越
·Superior mechanical and frequency characteristics.
●符合RoHS指令要求
·According with RoHS standard
