■ 特长 Features

●体积小、重量轻 ·Miniature and light weight. ● 适应再流焊与波峰焊 ·Suit for reflow and wave flow solder. ●电性能稳定，可靠性高 ·Stable electrical capability, high reliability. ●装配成本低，并与自动装贴设备匹配 ·Low assembly cost, suit for automatic SMTequipment. ●机械强度高、高频特性优越 ·Superior mechanical and frequency characteristics. ●符合RoHS指令要求 ·According with RoHS standard ■ 参考标准 Reference Standard GB/T 5729-2003 GB/T 9546-1995 JIS C 5223-1995 JIS C 5201-1998 JIS C 5202-1990