供应HERAEUS F352免清洗焊锡膏
深圳市升佳盈科技有限公司
深圳市宝安区沙井镇南岭路新二第三工业区12栋
产品属性
图文详情
品牌推荐
品牌/型号
贺利氏Heraeus
品牌
贺利氏Heraeus
产品规格
F352
F352
No Clean Solder Paste With Low Odour Characteristics For Reflow
Under Air and N2
Description
The solder pastes of the F352 series comprises a ready-touse
homogeneous mixture with low odour
characteristics, consisting of metal powder, binders,
solvents, fluxes and thixotropic agents.
Based on the reliable flux system of the F360 Series, this
flux was optimised to increase its wetting capability,
decrease the odour of the paste, avoid solder balls (on
chip-resistors and capacitors) and to increase tack time
and stencil life.
Solder pastes of the F352 Series does not contain any
halogen activators. They leave low, clear flux residues
with low ionic contamination and very high SIR.
These pastes are insensitive to temperature and
humidity.
Properties
Metal powder shape: spherical
Alloy, Particle Size, Melting
Point, Metal % and Viscosity: see reverse
Organic vehicle
If the paste is properly stored, its composition prevents
crusting and ensures the following rheological properties:
• excellent printability
• stable viscosity.
Flux activity
According to:
• ANSI-J-STD-004: LO
• ISO 9454-1: 1.1.3.C.
• IPC-SF-818: Type LR3N
Cleaning
The flux residues don't need to be cleaned. They may
remain on the circuit.
Processing
• Ensure that the paste has reached room temperature
before opening, to prevent condensation.
• Stir well prior to use.
• Print through a stencil or screen.
PRINTING DATA*:
Stencil thickness: ≤ 8 mil (≤ 200 Am)
Screen, mesh size: 80 mesh
Min. pitch: 16 mil = 400 Am
(Stencil thickness 150 Am)
Min. pad width: 8 mil = 200 Am
Clean wet paste: with isopropanol or similar
solvents.
* The above data are for information only. Final results
depend on different process parameters at the customer.
• - If the printing interval exceeds 1 hour, remove the
paste from the stencil/screen.
• The printed solder paste remains tacky up to 24 hours,
to allow device insertion. The exact time depends on
the environmental conditions, components´ size and
form, and on the accelerations/decelerations in the line.
• The peak temperature depends on the heat capacity of
the components.
• Reflow can be done under air or an inert
atmosphere.
Storage
Store the solder paste in tightly-sealed jars / syringes and
avoid exposure to sunlight and high humidity.
Storage of pastes in jars:
Maximum 6 months under the following conditions:
- storage in a refrigerator at 2 to 10 °C.
Storage of pastes in syringes:
Maximum 3 months under the following conditions:
- storage in a refrigerator at 2 to 10 °C
No Clean Solder Paste With Low Odour Characteristics For Reflow
Under Air and N2
Description
The solder pastes of the F352 series comprises a ready-touse
homogeneous mixture with low odour
characteristics, consisting of metal powder, binders,
solvents, fluxes and thixotropic agents.
Based on the reliable flux system of the F360 Series, this
flux was optimised to increase its wetting capability,
decrease the odour of the paste, avoid solder balls (on
chip-resistors and capacitors) and to increase tack time
and stencil life.
Solder pastes of the F352 Series does not contain any
halogen activators. They leave low, clear flux residues
with low ionic contamination and very high SIR.
These pastes are insensitive to temperature and
humidity.
Properties
Metal powder shape: spherical
Alloy, Particle Size, Melting
Point, Metal % and Viscosity: see reverse
Organic vehicle
If the paste is properly stored, its composition prevents
crusting and ensures the following rheological properties:
• excellent printability
• stable viscosity.
Flux activity
According to:
• ANSI-J-STD-004: LO
• ISO 9454-1: 1.1.3.C.
• IPC-SF-818: Type LR3N
Cleaning
The flux residues don't need to be cleaned. They may
remain on the circuit.
Processing
• Ensure that the paste has reached room temperature
before opening, to prevent condensation.
• Stir well prior to use.
• Print through a stencil or screen.
PRINTING DATA*:
Stencil thickness: ≤ 8 mil (≤ 200 Am)
Screen, mesh size: 80 mesh
Min. pitch: 16 mil = 400 Am
(Stencil thickness 150 Am)
Min. pad width: 8 mil = 200 Am
Clean wet paste: with isopropanol or similar
solvents.
* The above data are for information only. Final results
depend on different process parameters at the customer.
• - If the printing interval exceeds 1 hour, remove the
paste from the stencil/screen.
• The printed solder paste remains tacky up to 24 hours,
to allow device insertion. The exact time depends on
the environmental conditions, components´ size and
form, and on the accelerations/decelerations in the line.
• The peak temperature depends on the heat capacity of
the components.
• Reflow can be done under air or an inert
atmosphere.
Storage
Store the solder paste in tightly-sealed jars / syringes and
avoid exposure to sunlight and high humidity.
Storage of pastes in jars:
Maximum 6 months under the following conditions:
- storage in a refrigerator at 2 to 10 °C.
Storage of pastes in syringes:
Maximum 3 months under the following conditions:
- storage in a refrigerator at 2 to 10 °C
