No Clean Solder Pastes with good wetting and minimize voids

 
F 680 Solder Paste series is a state-of-the-art lead free no clean solder paste that promotes a outstanding wetting and
minimizes soldering defects. The F 680 Series exhibits minimal slump and has excellent print-after-wait performance. It
also provides a very low void level.
The F 680 flux system is specifically optimized for Sn/Ag/Cu alloy soldering.
This formula provides superior performance on a variety of surfaces finishes and leaves behind a clear residue. Reflow
can be accomplished in air or nitrogen.
Key Benefits
· Exceptional print to print
consistency
· Good wetting
· Min. 8 hour tack and work life
· Very good print after wait
performance
· Very low voiding
 

 
Indication: F680SAC Series
Alloy: Sn96.5/Ag3/Cu0.5
Other alloys are available on request.

 

Metal powder:
Particle size: Type 3 = 25 –45 microns (325/ 500 mesh)
Other powder sizes upon request.
Shape: Spherical
Melting Point: Sn96.5/Ag3/Cu0.5 = 217°C – 220° C
Composition: Sn96.5/Ag3/Cu0.5 = F680SA30C5-89M30
Density: Sn96.5/Ag3/Cu0.5 7,4 g/cc
Solder Paste:
Metal Content: Standard 89% ± 1%
Viscosity Range: 120 ± 50 Pas
Physica CSS 10 s-1
Density: 3,9 ± 0,2 g/ml
     

Typical Print Thickness: 0,4 – 0,65 mm pitch: 150 microns
<0,4 mm pitch: 120 microns
Minimum Pitch: 16 mil (400 microns)
Minimum Pad Width: 8 mil (200 microns, stencil thickness 150microns)