The products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing

Features and Benefits

 - 1.5W/m-K Thermal Conductivity

- High bond strength to a variety of surfaces

- Double sided pressure sensitive adhesive tape

 -High performance, thermally conductive acrylic

 Adhesive

-Withstand heat variation long term

Typical Applications Include

 -LED lighting

 -Cooling Components to the Chassis,

 Frame, or other type of heat spreader

- Mass Storage Drives

- Heat Pipe assemblies

- RDRAM Memory Moduies

- High Frequency Microprocessors

- Notebook and Desktop PCs