SA208FGSeries thermally conductive sensitiveadhesitive tapes bond heat sinks to hot

componnents.They adhere components tovertical heat sinks or metal chassis walls in place

of clips,screws or other mechanical  fasteners,and require no additional thermal compound.

Features and Benefits

- 0.9W/m-K Thermal Conductivity

- High bond strength to a variety of surfaces

- Double sided pressure sensitive adhesive tape

 -High performance, thermally conductive acrylic

 Adhesive

-Withstand heat variation long term

Typical Applications Include

 -LED lighting

 -Cooling Components to the Chassis,

 Frame, or other type of heat spreader

- Mass Storage Drives

- Heat Pipe assemblies

- RDRAM Memory Moduies

- High Frequency Microprocessors

- Notebook and Desktop PCs