The SASeries products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
Feature
　High bond strength to a variety of surfaces Double sided pressure sensitive adhesive tape
　High performance, thermally conductive acrylic adhesive
Typical Applications Include
　Mount heat sink onto BGA graphic processor or drive processor
　Mount heat spreader onto power converter PCB or onto motor control PCB
　High performance, thermally conductive acrylic adhesive
　Can be used instead of heat cure adhesive, screw mounting or clip mounting.