厂价直销 银膜手机FPC/银浆FPC
深圳市和创亿电子科技有限公司
中国 深圳
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品牌/型号
和创亿/HCYFPC001F
银浆柔性线路板板厚0.4MM单板尺寸:397.50*31.75MM,特殊工艺,最小孔径0.2MM
项目 内容常规特殊1层数NO.OF LAYER1～6层8层2完成板尺寸(最大)FINISHED BOARD SIAE (MAX)250*650mmOK3完成板尺寸(最小)FINISHED BOARD SIAE (MIN)8mm*12mmOK4板厚度(最大)BOARD THICKNESS (MAX)23 mil (0.6mm)OK5板厚度(最小)BOARD THICKNESS (MIN)3 mil (0.0765mm)（防焊）0.05mm6成品厚度公差(0.085mm≦板厚<0.4mm)FINESHED BOARD THICKNESS FOLERANCE (0.085MM≦BOARD THICKNESS<0.4mm)±2mil(±0.05m)OK7钻孔孔径(最大)DRILL HOLE DIAMETER (MAX)240 mil (6.0mm)6.5mm8钻孔孔径(最小)DRILL HOLE DIAMETER (MIN)8 mil (0.20mm)0.15mm9外形精度±0.1mm±0.05mm10完成孔径(最小) For machine drillFINESHED VIA DIAMETER (MIN)6 mil (0.15mm)0.10mm11底铜厚度(最小)OUTER LAYER BASE COPPER THICKNESS (MIN)1/2OZ(18um)1/3OZ12底铜厚度(最大)OUTER LAYER BASE COPPER THICKNESS (MAX)2OZ(72um)3OZ13绝缘层厚度(最小)INNER LAYER DIELECTRIC THICKNESS (MIN)0.0127mm(PI厚1/2mil)OK14绝缘层厚度(最大)INNER LAYER DIELECTRIC THICKNESS (MAX)0. 50mm(PI厚2mil)OK15材料类型BASE.MATERIALPI聚酰亚胺/PET聚脂无胶基材16孔电镀纵横比(最大)HOLE PLATING ASPECT RATIO (MAX)5:1OK17孔径公差(镀通孔)HOLE DIAMETER TOLERANCE (PTH)±3mil(±0.076 mm)OK18钻孔孔径公差(非镀通孔)HOLE DIAMETER TOLERANCG (NPTH)±2mil(±0.050mm)OK19孔位公差(与CAD数相比)HOLE POSITION TOLERAMCE (COMPARED WITH CAD DATA)±1mil(±0.025mm)OK20PTH孔孔壁铜厚PTH HOLE COPPER THICKNESS≧0.5mil(≧12.5um)≦1.0mil(≦25 um)≧8.0um项目 内容常规特殊1层数NO.OF LAYER1～6层8层2完成板尺寸(最大)FINISHED BOARD SIAE (MAX)250*650mmOK3完成板尺寸(最小)FINISHED BOARD SIAE (MIN)8mm*12mmOK4板厚度(最大)BOARD THICKNESS (MAX)23 mil (0.6mm)OK5板厚度(最小)BOARD THICKNESS (MIN)3 mil (0.0765mm)（防焊）0.05mm6成品厚度公差(0.085mm≦板厚<0.4mm)FINESHED BOARD THICKNESS FOLERANCE (0.085MM≦BOARD THICKNESS<0.4mm)±2mil(±0.05m)OK7钻孔孔径(最大)DRILL HOLE DIAMETER (MAX)240 mil (6.0mm)6.5mm8钻孔孔径(最小)DRILL HOLE DIAMETER (MIN)8 mil (0.20mm)0.15mm9外形精度±0.1mm±0.05mm10完成孔径(最小) For machine drillFINESHED VIA DIAMETER (MIN)6 mil (0.15mm)0.10mm11底铜厚度(最小)OUTER LAYER BASE COPPER THICKNESS (MIN)1/2OZ(18um)1/3OZ12底铜厚度(最大)OUTER LAYER BASE COPPER THICKNESS (MAX)2OZ(72um)3OZ13绝缘层厚度(最小)INNER LAYER DIELECTRIC THICKNESS (MIN)0.0127mm(PI厚1/2mil)OK14绝缘层厚度(最大)INNER LAYER DIELECTRIC THICKNESS (MAX)0. 50mm(PI厚2mil)OK15材料类型BASE.MATERIALPI聚酰亚胺/PET聚脂无胶基材16孔电镀纵横比(最大)HOLE PLATING ASPECT RATIO (MAX)5:1OK17孔径公差(镀通孔)HOLE DIAMETER TOLERANCE (PTH)±3mil(±0.076 mm)OK18钻孔孔径公差(非镀通孔)HOLE DIAMETER TOLERANCG (NPTH)±2mil(±0.050mm)OK19孔位公差(与CAD数相比)HOLE POSITION TOLERAMCE (COMPARED WITH CAD DATA)±1mil(±0.025mm)OK20PTH孔孔壁铜厚PTH HOLE COPPER THICKNESS≧0.5mil(≧12.5um)≦1.0mil(≦25 um)≧8.0um
项目 内容常规特殊1层数NO.OF LAYER1～6层8层2完成板尺寸(最大)FINISHED BOARD SIAE (MAX)250*650mmOK3完成板尺寸(最小)FINISHED BOARD SIAE (MIN)8mm*12mmOK4板厚度(最大)BOARD THICKNESS (MAX)23 mil (0.6mm)OK5板厚度(最小)BOARD THICKNESS (MIN)3 mil (0.0765mm)（防焊）0.05mm6成品厚度公差(0.085mm≦板厚<0.4mm)FINESHED BOARD THICKNESS FOLERANCE (0.085MM≦BOARD THICKNESS<0.4mm)±2mil(±0.05m)OK7钻孔孔径(最大)DRILL HOLE DIAMETER (MAX)240 mil (6.0mm)6.5mm8钻孔孔径(最小)DRILL HOLE DIAMETER (MIN)8 mil (0.20mm)0.15mm9外形精度±0.1mm±0.05mm10完成孔径(最小) For machine drillFINESHED VIA DIAMETER (MIN)6 mil (0.15mm)0.10mm11底铜厚度(最小)OUTER LAYER BASE COPPER THICKNESS (MIN)1/2OZ(18um)1/3OZ12底铜厚度(最大)OUTER LAYER BASE COPPER THICKNESS (MAX)2OZ(72um)3OZ13绝缘层厚度(最小)INNER LAYER DIELECTRIC THICKNESS (MIN)0.0127mm(PI厚1/2mil)OK14绝缘层厚度(最大)INNER LAYER DIELECTRIC THICKNESS (MAX)0. 50mm(PI厚2mil)OK15材料类型BASE.MATERIALPI聚酰亚胺/PET聚脂无胶基材16孔电镀纵横比(最大)HOLE PLATING ASPECT RATIO (MAX)5:1OK17孔径公差(镀通孔)HOLE DIAMETER TOLERANCE (PTH)±3mil(±0.076 mm)OK18钻孔孔径公差(非镀通孔)HOLE DIAMETER TOLERANCG (NPTH)±2mil(±0.050mm)OK19孔位公差(与CAD数相比)HOLE POSITION TOLERAMCE (COMPARED WITH CAD DATA)±1mil(±0.025mm)OK20PTH孔孔壁铜厚PTH HOLE COPPER THICKNESS≧0.5mil(≧12.5um)≦1.0mil(≦25 um)≧8.0um项目 内容常规特殊1层数NO.OF LAYER1～6层8层2完成板尺寸(最大)FINISHED BOARD SIAE (MAX)250*650mmOK3完成板尺寸(最小)FINISHED BOARD SIAE (MIN)8mm*12mmOK4板厚度(最大)BOARD THICKNESS (MAX)23 mil (0.6mm)OK5板厚度(最小)BOARD THICKNESS (MIN)3 mil (0.0765mm)（防焊）0.05mm6成品厚度公差(0.085mm≦板厚<0.4mm)FINESHED BOARD THICKNESS FOLERANCE (0.085MM≦BOARD THICKNESS<0.4mm)±2mil(±0.05m)OK7钻孔孔径(最大)DRILL HOLE DIAMETER (MAX)240 mil (6.0mm)6.5mm8钻孔孔径(最小)DRILL HOLE DIAMETER (MIN)8 mil (0.20mm)0.15mm9外形精度±0.1mm±0.05mm10完成孔径(最小) For machine drillFINESHED VIA DIAMETER (MIN)6 mil (0.15mm)0.10mm11底铜厚度(最小)OUTER LAYER BASE COPPER THICKNESS (MIN)1/2OZ(18um)1/3OZ12底铜厚度(最大)OUTER LAYER BASE COPPER THICKNESS (MAX)2OZ(72um)3OZ13绝缘层厚度(最小)INNER LAYER DIELECTRIC THICKNESS (MIN)0.0127mm(PI厚1/2mil)OK14绝缘层厚度(最大)INNER LAYER DIELECTRIC THICKNESS (MAX)0. 50mm(PI厚2mil)OK15材料类型BASE.MATERIALPI聚酰亚胺/PET聚脂无胶基材16孔电镀纵横比(最大)HOLE PLATING ASPECT RATIO (MAX)5:1OK17孔径公差(镀通孔)HOLE DIAMETER TOLERANCE (PTH)±3mil(±0.076 mm)OK18钻孔孔径公差(非镀通孔)HOLE DIAMETER TOLERANCG (NPTH)±2mil(±0.050mm)OK19孔位公差(与CAD数相比)HOLE POSITION TOLERAMCE (COMPARED WITH CAD DATA)±1mil(±0.025mm)OK20PTH孔孔壁铜厚PTH HOLE COPPER THICKNESS≧0.5mil(≧12.5um)≦1.0mil(≦25 um)≧8.0um
