T-3007-20基本技术资料： FILLER TYPE：SILVER填充剂 (T-3007-20)银(含量: 78-82%)Viscosity@20℃粘度 (T-3007-20)15,000~25,000cps/比重 (T-3007-20)3.6 ±0.2Recommended Cure Condition建议热化方式 (T-3007-20)30分钟/150℃/接着强度 (T-3007-20)1.5mm ×
1.5mm Si chip在150℃/30 分钟 68.7N在350℃ × 20 秒 12.1NGlass Transition Temperature (Tg)玻璃转换温度 (T-3007-20)120~140℃Coefficient of Thermal Expansion(TMA)温度膨胀系数 (T-3007-20)Below Tg: 9 × 10-5/℃Above Tg: 5 × 10-4/℃Thermal Conductivity @ 121℃热传导性 (T-3007-20)1.2 W/ m℃K/包装 (T-3007-20)200gms/罐; 20gms/针筒型Storage Life @ -15℃储存期限 (T-3007-20)6个月
