RC3300系列低温导电铜浆

Low Temperature Conductive Copper Paste Series

应用领域Application Field

适用于SMD工艺，各类硬质线路板电路印刷、多层板连接点的印刷、补线、粘接。薄膜太阳能电池

板的输出电极印刷，及各类接触电路，键盘导电，按键接触导电、导电粘结。

Applied to SMD process, and all kinds of hard circuit board printing, printing of MLB connection point, filling line, adhesive bonding. The output electrode printing of the thin film solar cell, and all kinds of contact circuit, keyboard conductive, key contacts conductive, conductive bond. 

特点Features

■ 低温固化，附着力强                         

■ 不需电镀，可直接焊锡                            

■ 印刷性好，使用灵活                         

■ 绿色环保，符合RoHS指令                   

■ Low temperature curing, high adhesion

■ Solder directly without plating

■ Good printing, flexible use

■ Green initiative, compliance with the RoHS

技术指标Technical Data

注：粘度检测条件为Brookfield  LV 4#,12RPM ，25±0.5℃；以上指标可根据客户要求定制。

Remarks: Viscosity detection conditions：Brookfield LVT, 4#，12rpm, 25±0.5℃. All specifications can be customized according

    to user needs.

建议工艺Suggest Process

稀释：用专用稀释剂，用量不要超过1% 

印刷：100-250目网版印刷

干燥：80~90℃10min

固化：150~160℃  30-50min（视印刷厚度、面

      积可适当增减时间）

焊接：适用烙铁手工焊锡，或喷锡、低温锡膏

      回流焊

储存：≤5℃密封贮存3个月

包装：1000g/2000g/罐

Dilution: With special thinner, total additional less than 1%

Printing: 100-250 mesh screen printing.

Drying:  10 minutes at 80~90℃

Curing:  150 ~160 ℃30-50 min (Increase or   

         decrease the time suitably according to  

         the printing thickness and area .)

Soldering: Iron soldering, or spray tin, low  

         temperature reflow soldering.

Storage:  3months under5℃ after sealed

Package:1000g/can or2000g/can