F14100系列欧姆接触银浆
Ohmic Contact Silver Paste Series
应用领域Application Field
本银浆为欧姆接触银浆,用于PTC、环形压敏电阻面电极的表面电极。
This silver paste is ohmic contact silver paste, applied to surface electrode of PTC thermistor and ring varistor.
特点Features
■ 低电阻率,欧姆接触性能佳
■ 欧姆接触银浆与二次银浆共烧,简化烧结
工艺和缩短加工时间
■ 可焊耐焊性好,附着强度
■ 符合环保要求,不含铅、镉
■ Low resistivity, excellent ohmic contact performance
■ Ohmic contact silver paste co-firing with second silver paste, simplify firing process and reduce the process time
■ Excellent solderable and soldering performance, high adhesion
■ Compliance environmental standard, lead and cadmium free
技术指标Technical Data
型号Type |
固含量
Solid Content
(%) |
粘度
Viscosity
(Kcps) |
细度/Fineness
(第二刻线/90%)
(Second Line/90%) |
适用性
Application |
F14101/02 |
75-85 |
350-600 |
≤(15.0μm/8.0μm) |
PTC、环形压敏电阻器
PTC thermistors, ring varistor |
注:粘度检测条件为Brookfield LV 4#,25±0.5℃;以上指标可根据客户特殊要求定制。需用相应或相似可焊银浆做表面银浆匹配使用。
Remarks: viscosity test condition: Brookfield LV 4 #, 3rpm, 25±0.5℃. All specifications can be customized according to users needs; need corresponded or similar solderable silver paste for surface silver paste matching using.
建议工艺Suggest Process
搅拌:用专用稀释剂调整粘度至适合印刷,
用前必须搅拌均匀
丝印:底层为欧姆银浆、表层为二次银浆,200-350目不锈钢网或尼龙丝网
干燥:链式烘炉 120-150℃ 10分钟
排胶:350℃10-15min,通风良好使有机系分解
烧银:链式隧道炉 550~600℃10-15min (最高温度)
清洗:酒精或松节油或者两者混合溶剂
包装:1000g/瓶或500g/瓶
储存:阴凉处不冷冻,温度为18-25℃,6个月
Stirring: Adjust paste viscosity to suitable for printing by special
solvent and stirring well before using.
Printing: The bottom is ohmic silver paste, the surface is second silver paste; 200-350 mesh stainless steel or nylon
mesh
Drying: Tunnel kiln, 120-150℃, 10 minutes
Resin: Decomposition: 350℃for 10-15 minutes, full airflow to ensure good binder burn out.
Sintering: Tunnel drying furnace, 550-600℃, 10-15
minutes (peak temperature)
Cleaning: Turpentine, ethyl alcohol or mixed solvent
Package:1000 g/can or500 g/can
Storage: 18~25℃, six months