• Wedge, Ball and Bump bonding
• 17 µm to 50 µm gold wire
• digital control with LCD display
• deep-access bond head 16 mm
• bond arm length 165 mm
• 20 programs storable
• heater stage and tool heater controller
• integrated 2-arm light source (fiber optic illuminator)
• motorized „Z“ bond head
• motorized 2“ wire spool holder
• 6:1 ratio X-Y manipulator
• loop height programmable
• semi-automatic and manual bonding mode
The WB-100 was designed as a multipurpose semiautomatic wire bond tool for R&D purposes and small series production.
Its bench top size allows easy transport and operation. There is one bond head available for wegde/wedge, ball/wedge and bump bonding mode. There is no hardware change necessary. Direct access and simple adjustment to all bond parameters and programs allow easy handling of the tool.
Options and accessories:
- HPR-90 heated work holder 90 mm diameter, 360° rotatable
- HP-100 heated work holder 100 x 100 mm
- HP-150 heated work holder 150 x 100 mm
- HP-200 heated work holder 200 x 150 mm
- TH-TC Tool heater with thermocouple
Ultrasonic system: PLL control 62 kHz transducer
Ultrasonic power: 0 - 2 watt
Bond time: 15 - 5000 msec.
Bond force: 15 - 100 cN
Ball bonding tool: 1,58 (dia.) x 19 mm length
Gold wire diameter: 17 - 50 µm
Motorized Z travel: 20 mm
Throat depth: 165 mm
Fine table motion: 20 mm
Mouse ratio: 6:1
Motorized wire spool Model MW
Wire termination: Bond head tear
Wire feed angle: 90°
Wire: 12 - 50 µm (2“ wire spool)
Wire control: by infrared sensor and microcontroller
Transducer Model WBT140 Wedge und Ball Transducer
Frequency: 62 kHz
Overall length: 185 mm
Horn length: 140 mm
Collar length: 23 mm
Collar diameter: 19 mm
Tool hole: 16 mm
Heated work holder Model HP-60
Heated area: 60 mm diam.
Temperature: max. 250 °C
Heat controller: ± 1 °C
Height: adjustable 66-78 mm
Electrical requirements WB-100
Voltage: 100 - 240 V, 50 - 60 Hz
Current: max. 5 A
Dimensions: 680 x 640 x 490 mm (27 x 25 x 19“)
Weight: 45 kg
