Alpha OM5100是一款低锡渣、免清有铅锡膏,3号粉,成分为63Sn/37Pb。
Alpha OM5100采用流变学优化的助焊剂能够对实现很好的可重复性和更环保。Alpha OM5100已优化活的性系统,在改进焊点可焊性、焊球和其它焊接缺陷的同时能保证长期的可靠性。大大降低缺陷,满足工序、设备和材料的稳定性和可重复性。
无铅锡膏选择指南
Performance Indicators | Product | Alloy | Powder | Flux J-STD 004 Classification | Halogen Content |
SACX Plus 0307 | Innolot | SAC 305 | MAXREL™ Plus | Sb/Bi/Ag | SBX02 | HRL1 | Type 3 | Type 4 | Type 4.5 | Type 5 |
Vacuum Solder Capable | |
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| ROL0 | ND |
Ultra-Low Voiding | |
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| ROL0 | ND |
Non-Eutectic & Low-Temperature | |
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| • | ROL0 | NA |
Fine Feature & Ultra-cleanable | |
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| • | ROM0 | ND |
Low Temp Reflow | |
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| ROL0 | ND |
Enabling Ultra-Fine Feature Printing | | • |
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| • | ROL0 | ND |
Universal, Highest Print Speed | |
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| ROL0 | ND |
Universal, Pin Testable, Enclosed Print Heads | |
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| ROL0 | ND |
Enabling 0.4mm BGA Assembly | |
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| ROL0 | ND |
High Soak Profile, Paste in Through Hole | | • | • | • | •
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| • | • | • | • | ROL0 | ND |
Increased Spread Wetting, Excellent HIP | | • | • | • | • |
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| • | • | • | • | ROL0 | ND |
Universal Water Soluble | |
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| ORH0 | NA |
Low Melting Point Water Soluble | |
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| ORH0 | NA |
High Value Pin Testable SACX Alloy | | • |
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| ROM0 | <900 ppm |
Package-on-Package Dip Paste | |
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| • | ROL0 | ND |
Package-on-Package Dip Tacky Flux | |
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| NA | ND |
Jetting Solder Paste | |
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| • | ROL0 | ND |
Excellent paste in through hole performance, low melting point alloy | |
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| ROL0 | ND
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