Alpha OM340是一款无铅免清洗锡膏，SAC305成分为Sn96.5Ag3.0Cu0.5。
Alpha OM340在线测试上实现业界中良好的防头枕缺陷性能和合格良率。OM340特别在超细间距可重复性(11mil)和产量要求较高的应用场合，在回流工艺窗口保证了其在CuOSP材料上,具有各种沉积大小上理想的聚结性，阻止随机焊球和锡珠产生的优良性能。
无铅锡膏选择指南
| Performance Indicators | Product | Alloy | Powder | Flux J-STD 004 Classification | Halogen Content |
| SACX Plus 0307 | Innolot | SAC 305 | MAXREL™ Plus | Sb/Bi/Ag | SBX02 | HRL1 | Type 3 | Type 4 | Type 4.5 | Type 5 |
| Vacuum Solder Capable | |
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| ROL0 | ND |
| Ultra-Low Voiding | |
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| ROL0 | ND |
| Non-Eutectic & Low-Temperature | |
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| • | ROL0 | NA |
| Fine Feature & Ultra-cleanable | |
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| • | ROM0 | ND |
| Low Temp Reflow | |
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| ROL0 | ND |
| Enabling Ultra-Fine Feature Printing | | • |
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| • | ROL0 | ND |
| Universal, Highest Print Speed | |
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| ROL0 | ND |
| Universal, Pin Testable, Enclosed Print Heads | |
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| ROL0 | ND |
| Enabling 0.4mm BGA Assembly | |
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| ROL0 | ND |
| High Soak Profile, Paste in Through Hole | | • | • | • | •
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| • | • | • | • | ROL0 | ND |
| Increased Spread Wetting, Excellent HIP | | • | • | • | • |
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| • | • | • | • | ROL0 | ND |
| Universal Water Soluble | |
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| ORH0 | NA |
| Low Melting Point Water Soluble | |
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| ORH0 | NA |
| High Value Pin Testable SACX Alloy | | • |
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| ROM0 | <900 ppm |
| Package-on-Package Dip Paste | |
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| • | ROL0 | ND |
| Package-on-Package Dip Tacky Flux | |
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| NA | ND |
| Jetting Solder Paste | |
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| • | ROL0 | ND |
| Excellent paste in through hole performance, low melting point alloy | |
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| ROL0 | ND
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