Alpha CVP-520是一款低温锡膏，无铅，免清洗，不含卤素。设计用于实现低温表面贴装组装技术。无铅合金熔点低于 140°C，Alpha CVP-520低温锡膏已成功在 155°C 到 190°C 之间用于峰值回流曲线。
Alpha CVP-520挑选的锡铋银合金可保证熔化和重新凝固过程中较低的熔点,良好的抗热循环龟裂能力，助焊剂残留是无色透明的,并具有高于行业标准要求的电阻率。
无铅锡膏选择指南
| Performance Indicators | Product | Alloy | Powder | Flux J-STD 004 Classification | Halogen Content |
| SACX Plus 0307 | Innolot | SAC 305 | MAXREL™ Plus | Sb/Bi/Ag | SBX02 | HRL1 | Type 3 | Type 4 | Type 4.5 | Type 5 |
| Vacuum Solder Capable | |
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| ROL0 | ND |
| Ultra-Low Voiding | |
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| ROL0 | ND |
| Non-Eutectic & Low-Temperature | |
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| • | ROL0 | NA |
| Fine Feature & Ultra-cleanable | |
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| • | ROM0 | ND |
| Low Temp Reflow | |
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| ROL0 | ND |
| Enabling Ultra-Fine Feature Printing | | • |
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| • | ROL0 | ND |
| Universal, Highest Print Speed | |
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| ROL0 | ND |
| Universal, Pin Testable, Enclosed Print Heads | |
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| ROL0 | ND |
| Enabling 0.4mm BGA Assembly | |
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| ROL0 | ND |
| High Soak Profile, Paste in Through Hole | | • | • | • | •
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| • | • | • | • | ROL0 | ND |
| Increased Spread Wetting, Excellent HIP | | • | • | • | • |
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| • | • | • | • | ROL0 | ND |
| Universal Water Soluble | |
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| ORH0 | NA |
| Low Melting Point Water Soluble | |
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| ORH0 | NA |
| High Value Pin Testable SACX Alloy | | • |
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| ROM0 | <900 ppm |
| Package-on-Package Dip Paste | |
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| • | ROL0 | ND |
| Package-on-Package Dip Tacky Flux | |
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| NA | ND |
| Jetting Solder Paste | |
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| • | ROL0 | ND |
| Excellent paste in through hole performance, low melting point alloy | |
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| ROL0 | ND
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