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Technical Information
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May 2007
®
Kalrez 9100
Product Description
Kalrez® 9100 is a new, amber translucent product
targeted specifically for deposition process
applications, i.e., HDPCVD, PECVD, SACVD, Metal
CVD, ALD, etc. It has also exhibited excellent
performance in "select" etching and ashing/stripping
process applications. Kalrez® 9100 has been
specifically designed for low erosion and ultra-low
particle generation in harsh plasma environments. It
offers outstanding thermal stability, very low
outgassing as well as excellent elastic recovery and
mechanical strength properties and is well suited for
both static and dynamic sealing applications. A
maximum continuous service temperature of 300°C is
suggested. Ultrapure post-cleaning and packaging is
standard for all parts made from Kalrez® 9100.
Features/Benefits Typical Physical Properties1
• Low erosion rate and ultra-low Property Typical
Value
particle generation in oxygen and
fluorine-based plasmas Color Amber
Translucent
• Excellent resistance to dry process 2
Hardness, Shore M 74
chemistry 3
100% Modulus , MPa 4.27
• Excellent thermal stability 3
Tensile Strength @ Break , MPa 11.85
• Very low outgassing properties and Elongation @ Break3, % 220
metals content 4
Compression Set , %
• Excellent elastic recovery and low 70 Hrs. @204°C 17
compression set properties 70 Hrs. @250°C 21
70 Hrs. @300°C 53
Maximum Continuous Service,
Suggested Applications Temperature5, °C 300
1
• Gas inlet/orifice seals Not to be used for specification purposes
2 ASTM D2240 & D1414 (AS568 K214 O-ring test specimens)
• Chamber lid seals 3
ASTM D412 & D1414 (AS568 K214 O-ring test specimens)
• Isolation valve seals 4 ASTM D395B & D1414 (AS568 K214 O-ring test specimens)
5 DuPont Performance Elastomers proprietary test method
• Bonded gate valves/slit valve door
seals
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Particle Generation
Conventional perfluoroelastomer (FFKM) sealing materials normally contain carbon black
and/or mineral fillers. Newer compounds are either unfilled or formulated with polymeric
fillers. Plasma resistance can be significantly different depending on the type of filler used. If
the filler has high resistance to plasma, such as BaSO , TiO , etc., it can “shield” the
4 2
polymer to reduce erosion or weight loss, but have the high potential for particle generation
by leaving discrete particles behind once the polymer has become etched. Unfilled and
polymeric filled compounds essentially contain no other elements other than carbon, fluorine
and oxygen, which can be completely etched to form volatiles, thereby significantly reducing
the potential for contamination. Figure 1 shows the relative particle generation of Kalrez®
9100 versus a nano-silica and a metallic oxide filled FFKM compound in different plasmas.
Figure 1 - Relative Particle Generation (Log Scale)
6 Hours @ 200 Watts, 0.5 Torr, Direct Exposure, Downstream Plasma Reactor
10000
)
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G
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1
Kalrez® 9100 Nano-Silica Filled FFKM Metallic Oxide Filled FFKM
Fabs Choose Kalrez® 9100 For Improved Performance
Kalrez® 9100 has been reported to significantly improve wafer production in a variety of
semiconductor process applications, i.e., HDPCVD, PECVD, etching, ashing, etc., where
oxygen and fluorinated plasmas are used during the cleaning cycle. In a number of
evaluations at fabline customers, Kalrez® 9100 exhibited less erosion, lower particle
generation and longer seal life compared to competitive perfluoroelastomers in both static
and dynamic sealing applications.
Case Report # 5903 - PM Cycle Extended 3X! @ Major US Fab Line
• Fab line has extended pm cycle from 60 to 180 days
• No evidence of erosion, leakage, mechanical damage or compression set after 180
days of service
• Equipment Platform -- Novellus Concept Two Speed®
• Process -- HDPCVD / STI
• Process Chemistry -- SiH , He, O
4 2
• Cleaning Chemistry -- NF3 plasma @ 4000 watts
• Seal Locations -- slit valve door, inner gas manifold ring, MESC flange insert, Iso-
poppet valve, turbo gate, dome lid
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Case Report # 6441 –PM Target Exceeded @ Major European Research Center
• No/minimal evidence of erosion or degradation after processing 5,000 wafers
• Research center is currently conducting testing to determine maximum practical seal
life
• Equipment Platform – Applied Materials Centura® Ultima®
• Process – HDPCVD / STI
• Process Chemistry – SiH4, He, O2,
• Cleaning Chemistry -- NF3 plasma @ 3000 watts
• Seal Location – roughing isolation valve poppet seal, top nozzle assembly o-ring seal
®
Figure 2. Kalrez 9100 and incumbent seals after processing 5000 wafers. It was the research center’s opinion
®
that the Kalrez 9100 seals could have continued to function beyond the scheduled PM cycle of 5,000 wafers.
®
Kalrez 9100 Poppet Seal Incumbent FFKM Poppet Seal
®
Kalrez 9100 Top Nozzle Seal Incumbent FFKM Top Nozzle Seal
Case Report # 6376- PM Cycle Improved 2X! @ Major European Fab Line
• Fabline has extended pm cycle from 30,000 to >55,000 pairs of wafers
• No evidence of erosion, mechanical damage, compression set or deformation of the
seal lip after processing >55,000 pairs of wafers
• Equipment Platform -- Applied Materials Producer® Low-k
• Process -- PECVD / Black Diamond®
• Process Chemistry -- Trimethyl silane (TMS), O2
• Cleaning Chemistry -- NF3 plasma via remote plasma source
• Seal Location -- VAT MONOVAT® bonded door
Case Report # 6738 - PM Cycle Extended 3X! @ Major US Fab Line
• Fabline has extended pm cycle from 400 to 1200 Rf hours
• No evidence of degradation or cracking after 1200 Rf hours of service
• Equipment Platform – Lam Research TCP-9600
• Process – Metal Etch & Resist Strip/Ash
• Process Chemistry – Cl , BCl , Water Vapor
2 3
• Cleaning Chemistry – O2 plasma (cleans ash deposits after every wafer)
• Seal Location – custom seal for slit valve opening
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Case Report # 6302 - PM Cycle Extended 3X! @ Major US Fab Line
• Fab line has extended pm cycle from 6,000 to 18,000 wafers
• No evidence of erosion, cracking or compression set after processing 18,000 wafers
• Equipment Platform – Tokyo Electron SCCM Etch Chamber
• Process – Oxide Etch & Dual Damascene Copper
• Process Chemistry – C F , C F , C F , O , Ar
4 8 4 6 5 8 2
• Cleaning Chemistry – CF & O plasma
4 2
• Seal Location – pendulum valve seal kit
Case Report # 5415 - PM Cycle Extended 3X! @ Major US Fab Line
• Fab line has extended pm cycle from 6 to 18 months
• No evidence of erosion, cracking or leakage after 18 months of service
• Equipment Platform – Mattson Aspen II (Grid Shielded System)
• Process – ICP (Ashing)
• Process Chemistry – CF , O , Forming Gas
4 2
• Cleaning Chemistry – N/A
• Seal Location – quartz tube
For further information please contact one of the offices below, or visit our website at
The information set forth herein is furnished free of charge and is based on technical data that DuPont Performance Elastomers believes to be
reliable. It is intended for use by persons having technical skill, at their own discretion and risk. Handling precaution information is given with the
understanding that those using it will satisfy themselves that their particular conditions of use present no health or safety hazards. Since
conditions of product use and disposal are outside our control, we make no warranties, express or implied, and assume no liability in connection
with any use of this information. As with any material, evaluation of any compound under end-use conditions prior to specification is essential.
Nothing herein is to be taken as a license to operate or a recommendation to infringe on patents. Caution: Do not use in medical applications involving permanent implantation in the human body. For other medical applications, discuss with
your DuPont Performance Elastomers customer service representative and read Medical Caution Statement H-69237.
™
DuPont is a trademark of DuPont and its affiliates.
Kalrez® is a registered trademark of DuPont Performance Elastomers.
® ® ®
Centura Ultima and Producer are registered trademarks of Applied Materials
Concept Two Speed® is a registered trademark of Novellus
MONOVAT® is a registered trademark of VAT Vacuumvalves A.G.
Copyright © 2006 DuPont Performance Elastomers. All Rights Reserved.
(02/06) Printed in U.S.A.
Reorder no: KZE-A10445-00-D0507
